JPS60236229A - 位置合せ方法 - Google Patents

位置合せ方法

Info

Publication number
JPS60236229A
JPS60236229A JP59091740A JP9174084A JPS60236229A JP S60236229 A JPS60236229 A JP S60236229A JP 59091740 A JP59091740 A JP 59091740A JP 9174084 A JP9174084 A JP 9174084A JP S60236229 A JPS60236229 A JP S60236229A
Authority
JP
Japan
Prior art keywords
mark
reference mark
wafer
alignment
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59091740A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0362013B2 (en]
Inventor
Yoichi Kuroki
黒木　洋一
Naoki Ayada
綾田　直樹
Fumiyoshi Hamazaki
浜崎　文栄
Takashi Matsumura
松村　尊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP59091740A priority Critical patent/JPS60236229A/ja
Publication of JPS60236229A publication Critical patent/JPS60236229A/ja
Publication of JPH0362013B2 publication Critical patent/JPH0362013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP59091740A 1984-05-10 1984-05-10 位置合せ方法 Granted JPS60236229A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59091740A JPS60236229A (ja) 1984-05-10 1984-05-10 位置合せ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59091740A JPS60236229A (ja) 1984-05-10 1984-05-10 位置合せ方法

Publications (2)

Publication Number Publication Date
JPS60236229A true JPS60236229A (ja) 1985-11-25
JPH0362013B2 JPH0362013B2 (en]) 1991-09-24

Family

ID=14034914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59091740A Granted JPS60236229A (ja) 1984-05-10 1984-05-10 位置合せ方法

Country Status (1)

Country Link
JP (1) JPS60236229A (en])

Also Published As

Publication number Publication date
JPH0362013B2 (en]) 1991-09-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term